Semiconductors

Chipmore Technology颀中科技

Standard profile, compiled by hefei.be from public sourceschip packaging and testingbumpingdisplay driver chipsflip-chip

About the company

Chipmore Technology offers bumping, wafer testing and packaging services, chiefly for display driver chips and increasingly for power management and RF chips. It is China’s largest and the world’s third-largest packager and tester of display driver chips. Registered in Hefei’s Xinzhan district, with a second base in Suzhou, it listed on the STAR Market in 2023 and reported 2025 revenue of about 2.19 billion yuan.

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