Semiconductors

Union Semiconductor (Hefei)汇成股份

Standard profile, compiled by hefei.be from public sourceschip packaging and testinggold bumpingdisplay driver chipsOSAT

About the company

Union Semiconductor packages and tests display driver chips for LCD and OLED panels, covering gold bumping, wafer probing, and chip-on-glass and chip-on-film assembly. It was one of the first companies in mainland China with gold bumping capability. Based in Hefei’s Xinzhan district, it reported 2025 revenue of 1.78 billion yuan, up 18.8%, and counts BOE and Visionox among its direct customers.

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